Test Services
ASECL Test Expertise
One of the major test center of GSM/CDMA Wireless communication among subcontract test houses. The product experiences included:
• Wireless:
Cell-phone Mixed-Signal products
VHF/UHF Wide Band application
Cordless phone IF TX/RX and Synthesizer
PLL, AD/DA & Power Management
Base Band DSP
GPS chips
• Data-Comm:
ADSL/xXDSL devices
BlueTooth/2.4GHz
WLAN(802.11x)/6GHz
Full Range of IC Test Service
Value Proposition
• Wafer Sort
6" thru 12", Ambient/Hot, Ink/Inkless, Bumped Wafer
• Laser Repair• Final Test
Ambient/Hot/Cold full range temperature
• Product Yield Analysis• Real time WIP & Quality
Control System
• Electronic Yield Data• Lead Scan / TnR
• Drop Ship
Value to Customer
• Full turnkey solution: Wafer Bumping, Wafer Probe, IC Assembly, Test, and Drop Ship. Providing total semiconductor back-end solution in one campus.
• Strong engineering team with expertise of package design, development, characterization, process improvement and test program development.
• Full Range of IC Test Service includes Wafer Sort and Final Test; World class Wireline/Wireless/Bluetooth/Automotive Test manufacturing facilities.
• Expertise in various Analog/Logic/Mixed-Signal/ RF/WLAN ATE platforms.
• Highly computer integrated manufacturing service. Web-based transparent product tracking system.
• Strong financial position & flexible capacity expansion to meet customer demand.