Company Overview
ASE ChungLi (ASECL), a member of the ASE Group, delivers comprehensive semiconductor manufacturing services,
including engineering test, package design, IC assembly, wafer probing, final test, and design manufacturing
services (DMS).
With advanced technologies and vast capacity, ASECL provides industry-leading backend manufacturing services
at its Intelligible Park facility in ChungLi. Our turnkey services encompass a wide variety of backend
processes, including IC test program design, front-end engineering test, substrate and package design,
substrate manufacturing, as well as package tooling during the wafer fabrication process. These services are
complemented by ASECL’s seamless logistics management, evident throughout all stages, and ultimately
responsible for driving down cycle times and increasing efficiency.
ASECL possesses expertise in product and process technology, essential for the development of leading-edge
packages including Chip Scale Packages (CSP), Multi Chip Modules (MCM), thermally enhanced packages, flip chip
packages, and memory.
Located in the heart of Taiwan’s semiconductor cluster, ASECL leverages its prime location to serve both
fabless companies and integrated device manufacturers (IDMs), who cater to the expanding consumer, computer,
and communications markets.
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