Innovation and quality are values paramount to ASECL's success in delivering leading-edge technologies and solutions to customers, while meeting demanding requirements related to electrical performance, heat dissipation, cost, and cycle time. ASECL continues to invest heavily in research and development, and has a highly talented engineering team who are dedicated to the development of advanced manufacturing processes. The advanced manufacturing process technologies that we provide include fine pitch wire bonding, Chip Scale Packaging(CSP), 3D package and System in Package(SiP). We also offer standard products such as SOP, QFP and PBGA. Our broad product portfolio provides customers the flexibility to select package types that best suit the needs of their chip design.

For more information, please contact ASE sales office.

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