Products
Innovation and quality are values paramount to ASECL's success in delivering leading-edge technologies and
solutions to customers, while meeting demanding requirements related to electrical performance, heat
dissipation, cost, and cycle time. ASECL continues to invest heavily in research and development, and has a
highly talented engineering team who are dedicated to the development of advanced manufacturing processes. The
advanced manufacturing process technologies that we provide include fine pitch wire bonding, Chip Scale
Packaging(CSP), 3D package and System in Package(SiP). We also offer standard products such as SOP, QFP and
PBGA. Our broad product portfolio provides customers the flexibility to select package types that best suit
the needs of their chip design.
For more information, please contact ASE sales office.
©
ASE ChungLi, All Rights Reserved. Terms of
Use