Bumping & WLCSP

Product Overview
ASECL's WLCSP technology is licensed from FCT, has been qualified since 2000, and to date, over several million wafers have been shipped to customers around the world. ASE ChungLi provides a variety of wafer bumping services including Standard (FOC), Repassivation (REP) and Redistribution (RDL) using different type of dielectric material for standard eutectic bump and lead free bumps. Our bumping capabilities and technologies mean that we can offer customers a full turn-key solution, by providing services ranging from product design to drop shipment, including bumping, wafer grind, marking, wafer sort, singulation, and tape and reel, or waffle pack. Our turnkey solution provides customers with the opportunity to meet demanding time-to-market demands. ASECL's goal is to provide the most cost effective and reliable WLCSP package solution possible to all our customers.

Applications
WLCSP provides the best solution required for compact, light, thin and highly dense packaged ICs, such as applications for communication products like cellular phones, PDAs and other portable electronics.

Features
Qualification in 6 inch and 8 inch bumping wafers
FOC, Repassivation and Redistribution WLCSP with PI/BCB/PBO dielectrics
Bumps option in printed paste bumping or drop ball technologies
Solder option in Eutectic SnPb and Pb-free
Backside grind thickness preference
Backside coating ready by Q4'2009
Laser mark – support white and dark mark
Shipping to customer in wafer form, tape-reel, or waffle pack
12 inch WLCSP to be ready by Q1, 2010

Package Offering
Printed Bump & WLCSP
Wafer size 150mm, 200 mm and 300mm( Q4,2006)
Pad metallization Al / Si / Cu, Al / Cu , CUP
UBM Type AL/NiV/Cu, Ti/NiV/Cu
Wafer Technology 0.13 FSG
Process FOC, Re-passivation, Redistribution, Ultra CSP®
Solder composition Eutetic 63/37, Pb-free SAC405, SAC105
Printed Bump pitch ( mininum ) Array: 150 um
Peripheral: 130 um
Drop Ball Bump pitch ( mininum ) Array: 400 um
Die size 1x1mm²~20x20mm²
Bump count 4~3600 bumps / die
Bump height 70um~300um
Bump height 70um~300um

Plated Bump
Technology available by Q3'2010
12" WLCSP available by Q2'2010

Reliability
Item Condition Duration Sampling Criteria Standard Status
Precondition 30°C
60%RH
  45/lot No Open/
Short Failure
No Die Crack
No Delamination
JEDEC A113-A
Level 3
Pass
HAST 130°C
33.5psig
85% RH
100hr 45/lot No Open/
Short Failure
JEDEC 22,
A110
Pass
Temperature
Cycling Test
-55°Cto+125°C
30 min/cycle
Air to air
100cycle
200cycle
500cycle
1000cycle
45/1ot No Open/
Short Failure
No Die Crack
No Delamination
JEDEC 22,
A104-A
Condition B
Pass
Temperature
Humidity
85°C
85%RH
168hr
500hr
1000hr
45/lot No Open/
Short Failure
JEDEC 22B
A101-A
Pass
High Temperature
Storage
150°C 168hr
500hr
1000hr
45/lot No Open/
Short Failure
JEDEC 22B
A103-A
Pass


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