Product Overview

Ball Grid Array (BGA) is an IC package, which places output pins in the form of a solder ball matrix. The traces of BGA are generally fabricated on laminated substrates, therefore the entire area of the substrate or film can be used for interconnection routing. As an added advantage, BGA packages have a lower ground or power inductance. This is achieved by assigning ground or power nets through a shorter current path to the PCB. These sophisticated capabilities make BGA a desirable package to implement electrical and thermal enhancements in response to needs for higher power and faster ICs.