QUAD

QFP
L/TQFP

Product Overview
Quad packages have been used for years in ASICs, DSPs, micro-controllers, and memory ICs. A wide range of open and close tools in quad packages offers low cost and reliable solutions for moderate and low pin ICs. Several state-of-the-art improvements on thermal and electrical issues regarding quad packages and MCM technology have been proposed. Meanwhile, to meet the requirements on compact and low profile electronic devices, thin quad packages have been in production to offer total package thickness as thin as 1.1mm.

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