Design Services

ASECL Test Expertise

One of the major test center of GSM/CDMA Wireless communication among subcontract test houses. The product experiences included:

• Wireless:

Cell-phone Mixed-Signal products
VHF/UHF Wide Band application
Cordless phone IF TX/RX and Synthesizer
PLL, AD/DA & Power Management
Base Band DSP
GPS chips

• RF-Power Amplifier: PA –900/1800/1900/2500MHz
• Data-Comm:

ADSL/xXDSL devices
BlueTooth/2.4GHz
WLAN(802.11x)/6GHz

• Memory Embedded: SRAM, MROM embedded and/or stack.

Full Range of IC Test Service

Value Proposition

• Wafer Sort

6" thru 12", Ambient/Hot, Ink/Inkless, Bumped Wafer

• Laser Repair
• Final Test

Ambient/Hot/Cold full range temperature

• Product Yield Analysis
• Real time WIP & Quality

Control System

• Electronic Yield Data
• Lead Scan / TnR
• Drop Ship

Value to Customer

• Full turnkey solution: Wafer Bumping, Wafer Probe, IC Assembly, Test, and Drop Ship. Providing total semiconductor back-end solution in one campus.

• Strong engineering team with expertise of package design, development, characterization, process improvement and test program development.

• Full Range of IC Test Service includes Wafer Sort and Final Test; World class Wireline/Wireless/Bluetooth/Automotive Test manufacturing facilities.

• Expertise in various Analog/Logic/Mixed-Signal/ RF/WLAN ATE platforms.

• Highly computer integrated manufacturing service. Web-based transparent product tracking system.

• Strong financial position & flexible capacity expansion to meet customer demand.



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