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Wirebond ASECL Package Milestone Wide Matrix Conversion on SOP & QFP Big Strip MAP BGA Program EPP(Green) Program 90 & 65 nm Wafer Technology Development L/T/V/W(F)BGA (MAP BGA) (Dimension in mm) L/LF BGA T/TF BGA VF BGA WFBGA Total Thickness 1.6 max 1.3 max 1.2 max 1.0max 0.7 max A Mold cap 0.8 0.7 0.54 0.45 0.37 0.25 B Substrate 0.36 0.26 0.26 0.22 0.22 0.15 C Ball Size 0.5/0.4 0.4/0.3 0.4/0.3 0.3 0.3 0.3   Package Size 3x3 ~ 27x27. Single mold cap design. Package I/O 10 ~ 600 I/Os. Various ball count toolings available. Solder ball pitch 1.27/ 1.0/ 0.8/ 0.75/ 0.65/ 0.5 mm Substrate layers 2 / 4 / 6 layers, Laminated or build-up substrate available. OSP is options Key Technology - Wire bond Die to die Bonding Reverse Bonding Stagger Bonding Overhang (4 mils dice – 1.0mm) Low loop bonding 2007 ASE ChungLi, All rights reserved. Terms of Use