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Wireless: |
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- Cell-phone Mixed-Signal products
- VHF/UHF Wide Band application
- Cordless phone IF TX/RX and Synthesizer
- PLL, AD/DA & Power Management
- Base Band DSP
- GPS chips |
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RF-Power Amplifier: PA –900/1800/1900/2500MHz |
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Data-Comm: |
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ADSL/xXDSL devices
BlueTooth/2.4GHz
WLAN(802.11x)/6GHz |
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Memory Embedded: SRAM, MROM embedded and/or stack. |
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Wafer Sort –
6" thru 12", Ambient/Hot, Ink/Inkless, Bumped Wafer |
| • |
Laser Repair |
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Final Test –
Ambient/Hot/Cold full range temperature |
| • |
Product Yield Analysis |
| • |
Real time WIP & Quality
Control System |
| • |
Electronic Yield Data |
| • |
Lead Scan / TnR |
| • |
Drop Ship |
| • |
Full turnkey solution: Wafer Bumping, Wafer Probe, IC Assembly, Test, and Drop Ship. Providing total semiconductor back-end solution in one campus. |
| • |
Strong engineering team with expertise of package design, development, characterization, process improvement and test program development. |
| • |
Full Range of IC Test Service includes Wafer Sort and Final Test; World class Wireline/Wireless/Bluetooth/Automotive Test manufacturing facilities. |
| • |
Expertise in various Analog/Logic/Mixed-Signal/ RF/WLAN ATE platforms. |
| • |
Highly computer integrated manufacturing service. Web-based transparent product tracking system. |
| • |
Strong financial position & flexible capacity expansion to meet customer demand. |
