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Bumping WLCSP Package Roadmap Technology Item Available 2007 2008 2009 DCOB* FOC Pitch (um) 180 150 - - REP 200 200 150 - RDL Pitch (um) I/O 85 75 65 65 Bump 225 200 150 150 aCSP (um) REP Ball Pitch (um) 400 400 300 200 Ball Size (um) 250 250 150 100 RDL Pitch (um) I/O 85 75 65 65 Ball 400 400 300 200 Ball Size (um) 250 250 150 100 aCSP (Ball Drop) Wafer Size (mm) 150/200 300 300 300 RDL Runner Material Sputtered Metal Sputtered Metal Plated Cu Embedded Passives on Chip Fan-out WLCSP Structure N/A Prototype Single Die Stack * DCOB means Direct Chip on Board * aCSP is ASE trademark for WLCSP Bumping WLCSP Packaging Technology Package Item Available 2007 2008 2009 Bumping UBM Al/NiV/Cu - - - Ti/NiV/Cu Ti/Cu/Cu/Ni Ti/Cu/Ni Pitch (Printed/Plated, um) 150/NA 150/130 150/120 150/100 Bump Composition Pb-free Plated - - Pb-free Pb-free Repassivation PI/PBO PI New Polymer - - aCSP Wafer Thickness (um) 200mm – 250 200 150 150 300 mm – N/A 250 200 200 Ball Pitch (um) 400 400 300 200 Ball Size (um) 250 250 150 100 2007 ASE ChungLi, All rights reserved. Terms of Use