Bumping

WLCSP Package Roadmap

Technology Item Available 2007 2008 2009
DCOB* FOC Pitch (um) 180 150 - -
REP 200 200 150 -
RDL Pitch (um) I/O 85 75 65 65
Bump 225 200 150 150
aCSP
(um)
REP Ball Pitch (um) 400 400 300 200
Ball Size (um) 250 250 150 100
RDL Pitch (um) I/O 85 75 65 65
Ball 400 400 300 200
Ball Size (um) 250 250 150 100
aCSP (Ball Drop) Wafer Size (mm) 150/200 300 300 300
RDL Runner Material Sputtered Metal Sputtered Metal Plated Cu Embedded Passives
on Chip
Fan-out WLCSP Structure N/A Prototype Single Die Stack
* DCOB means Direct Chip on Board
* aCSP is ASE trademark for WLCSP

Bumping WLCSP Packaging Technology

Package Item Available 2007 2008 2009
Bumping UBM Al/NiV/Cu - - -
Ti/NiV/Cu
Ti/Cu/Cu/Ni
Ti/Cu/Ni
Pitch (Printed/Plated, um) 150/NA 150/130 150/120 150/100
Bump Composition Pb-free Plated - -
Pb-free Pb-free
Repassivation PI/PBO PI New Polymer - -
aCSP Wafer Thickness (um) 200mm – 250 200 150 150
300 mm – N/A 250 200 200
Ball Pitch (um) 400 400 300 200
Ball Size (um) 250 250 150 100



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