Bumping
WLCSP Package Roadmap
Technology Item | Available | 2007 | 2008 | 2009 | |||
DCOB* | FOC | Pitch (um) | 180 | 150 | - | - | |
REP | 200 | 200 | 150 | - | |||
RDL | Pitch (um) | I/O | 85 | 75 | 65 | 65 | |
Bump | 225 | 200 | 150 | 150 | |||
aCSP (um) |
REP | Ball Pitch (um) | 400 | 400 | 300 | 200 | |
Ball Size (um) | 250 | 250 | 150 | 100 | |||
RDL | Pitch (um) | I/O | 85 | 75 | 65 | 65 | |
Ball | 400 | 400 | 300 | 200 | |||
Ball Size (um) | 250 | 250 | 150 | 100 | |||
aCSP (Ball Drop) | Wafer Size (mm) | 150/200 | 300 | 300 | 300 | ||
RDL Runner Material | Sputtered Metal | Sputtered Metal | Plated Cu | Embedded Passives | |||
on Chip | |||||||
Fan-out | WLCSP Structure | N/A | Prototype | Single Die | Stack |
* aCSP is ASE trademark for WLCSP
Bumping WLCSP Packaging Technology
Package Item | Available | 2007 | 2008 | 2009 | |
Bumping | UBM | Al/NiV/Cu | - | - | - |
Ti/NiV/Cu | |||||
Ti/Cu/Cu/Ni | |||||
Ti/Cu/Ni | |||||
Pitch (Printed/Plated, um) | 150/NA | 150/130 | 150/120 | 150/100 | |
Bump Composition | Pb-free | Plated | - | - | |
Pb-free | Pb-free | ||||
Repassivation | PI/PBO | PI New Polymer | - | - | |
aCSP | Wafer Thickness (um) | 200mm – 250 | 200 | 150 | 150 |
300 mm – N/A | 250 | 200 | 200 | ||
Ball Pitch (um) | 400 | 400 | 300 | 200 | |
Ball Size (um) | 250 | 250 | 150 | 100 |