Product Overview

Advanced Quad Flat No-lead. aQFN™ is solution for Lead less, multi-row and fine pitch lead frame package with enhanced Thermal/ Electrical performance. aQFN™ is a cost-effective packaging solution due to its economical materials and simpler packaging process.

Application

Telecommunication products
Cellular phones
Wireless LAN

Portable products
Personal digital assistants
Digital cameras

Low to medium lead count packages
Information appliances

Features

Low profile, small footprint and light weight
Free-form I/O design
Fine lead pitch 0.4mm
Excellent thermal performance
Excellent electrical performance
Good SMT performance
Cost effective package
Extend QFN I/O count up to 400

Reliability

Package Level

MSL	JEDEC Level 3, 30°C/ 60% RH	192 hours
PCT	121°C/ 100% RH/ 2 atm	168 hours
TCT	–65°C ~ 150°C	1000 cycles
HAST	130°C/ 85% RH/33.5 PSIG	96 hours
HTST	150°C	1000 cycles

Board Level

TCT	0~100°C, 2 CPH W/10 minute ramps and 5 minute duells respectively	1000 cycles
Drop Test	JEDEC standard	30 drops Min