Dual-in-Line TSSOP
Product Overview
The features of Thin Shrink Small Outline Package (TSSOP) is the smaller and thinner version of SOP. Due to the thin and small profile, TSSOP is suitable for applications in portable electronic products, cell phone and memory modules.
Features
Lead count available 16/24/38 JEDEC standard outlines Low profiles and light weight Pb free availablePackage Offering
| PACKAGE | BODY SIZE | LEAD COUNT | PITCH |
| TSSOP | 5x4.4 | 16 | 0.65 mm |
| TSSOP | 7.8x4.4 | 24 | 0.65 mm |
| TSSOP | 9.7x4.4 | 38 | 0.5 mm |