Product Overview

Based on a copper-made lead frame, VF Quad Flat No-lead (VFQFN) uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire to the PCB. The minimal interconnection makes the QFN packages competent to applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective solution to leadless packaging due to its economical materials and simpler packaging process.

Features

Small footprint
Low profile (<0.6, 0.15/F + 0.4 Mold)
Light weight > Cost effective
Better electrical performance
Better power dissipation

Package Characterization

QFN Structure

ASECL Saw QFN

Total Thickness: 0.6/0.9 A: Mold Cap : 0.4/0.65 B: Leadframe: 0.15/0.2

Package offering - Saw QFN

PACKAGE	BODY SIZE	LEAD COUNT	PITCH
SON	2x2 mm	6	.65 mm
SON	2x2 mm	8	.50 mm
SON	2x2 mm	8, 10	.40 mm
SON	3x2 mm	8	.50 mm
SON	3x3 mm	8	.65 mm
SON	3x3 mm	8, 10	.50 mm
SON	4x4 mm	8	.80 mm
SON	6x5 mm	8	1.27 mm
SON	8x6 mm	8	1.27 mm
VF/WF/UFQFN	3x3 mm	12, 16	.50 mm
VF/WF/UFQFN	3x3 mm	20	.40 mm
VF/WF/UFQFN	3.5x3.5 mm	14	.50 mm
VF/WF/UFQFN	3.5x9 mm	42	.50 mm
VF/WF/UFQFN	4x4 mm	16	.65 mm
VF/WF/UFQFN	4x4 mm	12, 20, 24	.50 mm
VF/WF/UFQFN	4x4 mm	28	.45 mm
VF/WF/UFQFN	4x4 mm	28, 32	.40 mm
VF/WF/UFQFN	4x7 mm	46	.40 mm
VF/WFQFN	5x5 mm	16	.80 mm
VF/WFQFN	5x5 mm	20	.65 mm
VF/WFQFN	5x5 mm	28, 32	.50 mm
VF/WFQFN	5x5 mm	40	.40 mm
VF/WFQFN	5x6 mm	36	.50 mm
VF/WFQFN	5x6.5 mm	48	.40 mm
VF/WFQFN	5x7 mm	38, 42	.50 mm
VF/WFQFN	5x7 mm	48	.40 mm
VF/WFQFN	5.5x6.5 mm	40	.50 mm
VF/WFQFN	mm6x4.5	44, 46	.40 mm
VF/WFQFN	6x6 mm	40	.50 mm
VF/WFQFN	6x6 mm	48	.40 mm
VF/WFQFN	6.5x4.5 mm	46	.40 mm
VF/WFQFN	6.5x5.5 mm	40	.50 mm
VF/WFQFN	7x7 mm	32	.65 mm
VF/WFQFN	7x7 mm	44, 48	.50 mm
VF/WFQFN	7x7 mm	56	.40 mm
VF/WFQFN	8x7 mm	52	.50 mm
VF/WFQFN	8x8 mm	52, 56	.50 mm
VF/WFQFN	8x8 mm	64, 68	.40 mm
VF/WFQFN	9x9 mm	64	.50 mm
VF/WFQFN	9x9 mm	76	.40 mm
VF/WFQFN	10x10 mm	68	.50 mm
VF/WFQFN	10x10 mm	88	.40 mm
VFQFN	12x12 mm	100	.40 mm