| Product Overview |
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| ASECL's flash memory card integrates design and packaging capabilities covering substrate designs with different flash option, assembly thin wafer technology, multi stacked die processes, low profile bonding, laser cutting technology and surface mount process with passive components, and memory card test. ASECL offers the packaging solution for the popular flash memory cards, including SD, mini SD and micro SD Card. |
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| Application |
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 Cellular phone
MP3 player
Digital Camera
PDA |
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| Features |
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High efficiency substrate design
12 inch wafer grinding capacity
Stacked die assembly experience
Thin wafer assembly capacity
Turnkey solution |
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| Available Package |
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| Product |
Size (mm) |
L/C |
Packaging |
Origination |
| MICRO SD |
11*15*0.7 |
8 |
2 dies Stacked + Side by Side |
SD Card Association |
| SD CARD |
32*24*2.1 |
9 |
2 dies Stacked + Side by Side |
SD Card Association |
| MINI SD |
21.5*20*1.4 |
11 |
2 dies Stacked + Side by Side |
SD Card Association |
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