| Product Overview |
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| Dual-in-line packages have been an established industrial standard for many years. These packages are constantly used in products like automotive devices, memory chips, analog ICs, and micro-controllers. These packages have evolved into state of the art technology primarily because of their robust reliability and great performance improvement. Dual-in-line packages provide an assortment of packaging capability for lower profile, fine lead pitch in low pin count devices, at a competitive manufacturing cost. |
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