| Product Overview |
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| The features of Thin Shrink Small Outline Package (TSSOP) is the smaller and thinner version of SOP. Due to the thin and small profile, TSSOP is suitable for applications in portable electronic products, cell phone and memory modules. |
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| Features |
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 Lead count available 16/24/38
JEDEC standard outlines
Low profiles and light weight
Pb free available |
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| Package Offering |
| |
| PACKAGE |
BODY SIZE |
LEAD COUNT |
PITCH |
| TSSOP |
5x4.4 |
16 |
0.65 mm |
| TSSOP |
7.8x4.4 |
24 |
0.65 mm |
| TSSOP |
9.7x4.4 |
38 |
0.5 mm |
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