| Product Overview |
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| The features of Small Outline Package (SOP) are similar to Small Outline J-leaded (SOJ) packages, but the lead’s ends are formed like the shape of gull-wings. ASE's SOP product was designed in compliance with JEDEC standards. The applications include low pin count packages used in cellular phones, wireless LAN, portable products, personal digital assistants (PDAs), digital cameras, video, and information appliances. |
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| Features |
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 Body size 150 up to 500 mils
JEDEC standard outlines
Lower cost
Pb free solution |
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| Package Offering |
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| PACKAGE |
BODY SIZE |
LEAD COUNT |
PITCH |
| SOP |
150 MIL |
8, 14, 16 |
1.27 mm |
| SOP EP |
150 MIL |
8, 16 |
1.27 mm |
| SOP (EIAJ) |
200 MIL |
14, 16, 20 |
1.27 mm |
| SOP |
300 MIL |
16, 20, 24,28, 32 |
1.27 mm |
| SOP EP |
300 MIL |
16, 24 |
1.27 mm |
| SOP |
330 MIL |
28 |
1.27 mm |
| SOP |
500 MIL |
44, 70 |
1.27 mm |
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