Leadless  QFN





Product Overview
 
Based on a copper-made lead frame, VF Quad Flat No-lead (VFQFN) uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire to the PCB. The minimal interconnection makes the QFN packages competent to applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective solution to leadless packaging due to its economical materials and simpler packaging process.



Features
 
Small footprint
Low profile (<0.6, 0.15/F + 0.4 Mold)
Light weight > Cost effective
Better electrical performance
Better power dissipation



Package Characterization
 
QFN Structure





ASECL Saw QFN

 
Total Thickness: 0.6/0.9
A: Mold Cap : 0.4/0.65
B: Leadframe: 0.15/0.2



Cavity Down QFN

  Technology and Approach:
Using the current leadframe downset capability to provide the upset leadframe.
Using the current technology, equipment and process on punch type QFN and QFP ePAD.



Package offering - Punch QFN
 
PACKAGE BODY SIZE LEAD COUNT PITCH
VFQFN 4x4 mm 16 .65 mm
VFQFN 4x4 mm 24 .5 mm
VFQFN 5x5 mm 28,32 .5 mm
VFQFN EP Top 5x5 mm 28 .5 mm
VFQFN (Non EP) 5.2x6.2 mm 32 .65 mm
VFQFN 6x6 mm 36,40 .5 mm
VFQFN 7x7 mm 32 .65 mm
VFQFN 7x7 mm 48 .5 mm
VFQFN 8x8 mm 44 .65 mm
VFQFN 8x8 mm 52 .5 mm
VFQFN (Non EP) 8x8 mm 56 .5 mm
VFQFN 9x9 mm 64 .50 mm
VFQFN 10x10 mm 68 .50 mm



Package offering - Saw QFN
 
PACKAGE BODY SIZE LEAD COUNT    PITCH
VFQFN 3x3 mm 16 .5 mm
VFQFN 3x4 mm 20 .5 mm
VFQFN 4x4 mm 10 .85 mm
VFQFN 4x4 mm 16 .65 mm
VFQFN 4x4 mm 20, 24 .5 mm
VFQFN 5x5 mm 28,32 .5 mm
VFQFN 5x5 mm 24 .65 mm
VFQFN 5.2x6.2 mm 32 .4 mm
VFQFN 5.5x6.5 mm 40 .5 mm
VFQFN 6x6 mm 28 .65 mm
VFQFN 6x6 mm 36 .5 mm
VFQFN 7x7 mm 48 .50 mm
VFQFN 8x8 mm 52,56 .50 mm
VFQFN 8x8 mm 44 .65 mm
VFQFN 9x9 mm 64 .50 mm
VFQFN Dual Raw 9x9 mm 100 .50 mm
VFQFN 10x10 mm 64,68 .50 mm



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