ASE ChungLi

Leadless LGA

Product Overview

Land Grid Array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially BGA but without the solder balls, and has the advantages of flexible routing and the capability of multi-chip module over other leadless packages. LGA is also a thinner (down to 0.66 mm) and lighter CSP. LGA technology was developed for lead free solution and spacing reduction on a mother board. This type of package has a chip size solution based on mature laminated substrate technology and material.

LGA is suitable for high performance ICs like single chip, logic and memory. Common applications for this type of package includes telecommunication products, personal digital assistants (PDAs) and memory cards.

Features

Thinner, lighter and smaller Chip-Scale Package.

Mature standard matrix BGA assembly process.

High through put

Lower cost

Excellent electrical and thermal performance

Pb free solution

Package Offering

	LGA	LLGA	TLGA	VLGA	WLGA	WLGA	Ultra LGA
Mold	1.6	1	0.8	0.7	0.54	0.45	0.37
Substrate	0.52	0.36	0.26	0.26	0.26	0.22	0.22
	0.38	0.26
Total thickness	2.2 max	1.4 max	1.2 max	1.0 max	0.8 max	0.8 max	0.6 max
Pitch	General pitches= 0.4, 0.5, 0.65, 0.8
	Customized pitches also available
Package Size	Standard body sizes = 3x3 ~ 27x27
	Other rectangular body sizes also available