| ASECL Business Offerings |
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Our competitive advantage is attributed to the combination of our assets, which include technical expertise, global logistics and integrated service centers. To date, ASECL continues to expand the scope of turnkey services to offer the most comprehensive semiconductor manufacturing services to our customers. This includes substrate design, substrate simulation, substrate manufacturing, bumping, assembly, module, and final test services.
Assembly
Packaging, also known as Assembly, serves to protect the die and facilitate electrical connections and heat dissipation. ASECL provides an extensive array of products, allowing our customers to choose the most suitable IC package. We provide the most complete, fully integrated services in the industry.
ASECL offers a broad range of semiconductor packages, which include plastic leaded chip carrier (PLCC), quad flat packages (QFP), thin quad flat packages (TQFP), small outline plastic packages (SOP), thin small outline plastic packages (TSOP) and ball grid array (BGA). Our most prominent packaging technologies include MCMs (2D and 3D MCMs), fine pitch, flip chip, and chip scale packaging (CSP).
In light of the progressive demand for packages with higher pin-counts and smaller sizes, we have started developing flip chip BGA, stacked-die BGA, and system-in-a-package products. We also offer Qual flat nonlead (QFN) and land grid array (LGA) package specially catered to the wireless market, automotive and other markets which require small packages.
Testing
Testing is carried out on packaged semiconductor devices to ensure that they meet performance specifications. This involves the use of sophisticated testing equipment and customized software programs to electrically test attributes of packaged integrated circuits, which include functionality, speed, predicted endurance and power consumption.
ASE provides a complete range of semiconductor testing services including front-end engineering testing, wafer probing, final testing of logic, mixed signal and memory semiconductors and other related services. Our testing services employ technology and expertise that are among the most advanced in the industry. We maintain different types of testing equipment to test a variety of semiconductor functions. We also work closely with our customers to design effective testing and conversion programs on multiple equipment platforms for particular semiconductors.
Material
In order to meet market demands for low cost, high performance, ecological, super-thin, and extremely stable micro IC packages, ASE Material is focused on developing new technology for substrate and lead frame fabrication processes. Key areas such as build-up and semi-additive processes for flip-chip package substrate are now being developed.
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